REACTIVE NANOFOILS
innojoin is the exclusive trading partner of Indium Corporation for nanofoil® 

Reactive nanofoils represent an innovative joining technology that creates stable connections within milliseconds with extremely low and locally limited heat input, which means that new types of soldering and joining processes can be realized.

Your advantages when joining with nanofilms

• Joining at room temperature: No heating of the components by the local heat source, in contrast to standard soldering processes such as B. when reflow soldering

• No structural changes in the base material due to the low energy input

• Minimal thermal influence on temperature-sensitive components, as the heat only acts for a short time

• Low-stress connection of materials with significantly different thermal expansion coefficients possible (e.g. aluminum/steel, ceramic/steel, glass/copper)

• Flux-free process, i.e. H. no organic residues on the substrates

• Process flexibility: Degrees of freedom in lot selection and process sequence

• Extremely fast and precise joining

• Flat connection with good thermal and electrical conductivity

• No outgassing and no aging in the joining zone

• Joining process possible in a vacuum because no oxygen is necessary

• Use of quality assurance procedures such as ultrasound and computer tomography possible

• High joint quality due to very low error rates (<2%)